PECVD silicon carbide is a highly durable thin film with many exciting characteristics that make it an attractive film for building specialized microelectronic devices. High thermal conductivity, high mechanical strength, and high chemical inertness are just a few properties of this exceptional film. Since PECVD silicon carbide is resistant to KOH, you can also use this material as a hard mask for bulk micromachining of your finished wafers.

To learn more about silicon carbide please check our links page!

Our most popular sputtered films include:

Titanium
Chrome
Aluminum
Aluminum Alloys
Copper
Tantalum
Silicon
Silicon Nitride

Specifications

Thickness range: 100Å - 2000Å
Thickness tolerance: +/-7%
Within wafer uniformity: +/-7% or better
Wafer to wafer uniformity: +/-7% or better
Sides processed: One
Refractive index: 2.3+/-.15
Film stress: -1000MPa (Compressive)
Wafer size: 50mm, 100mm, 125mm, 150mm, 200mm, 300mm
Wafer thickness: 100µm - 2,000µm
Wafer material: Silicon, Silicon on Insulator, Quartz
Temperature: 350C° - 400C°
Gases: Silane, Methane
Equipment: PlasmaTherm batch PECVD deposition tool

MEMS FABRICATION

Learn how our MEMS Foundry can reduce your cost, cut your lead time and increase your bottom line
more >>>

WAFER SERVICES

Our MEMS Foundry maintains one of most diverse compilation of Thin Films Processes commercially available
more >>>

REQUEST A QUOTE

Let us know how we can help you.
more >>>


Microelectronics Manufacturing Semiconductor Devices Physical Vapor Deposition Thin Film Deposition Silicon Wafer Processing MEMS Sensors	Silicon Wafer Supplier Silicon Wafers Silicon Wafer Processing Silicon Wafer Manufacturing Solar Wafers MEMS Mirror	PECVD Processing LPCVD Processing Wet Thermal Oxidation Thermal Annealing Sputtered Metals MEMS Manufacturer	SemiConductor Company SemiConductor Manufacturer MEMS Manufacturer MEMS Foundry Thin Film Sputtering Site Map