Wire Bondable Thin Film Chip Resistor
As technology advances so does the demand for smaller components. Our engineering team understands this challenge and has developed passive components manufactured by our MEMS foundry providing low profile wire bondable chips for device integration.
Rogue Valley Microdevices has developed the perfect resistor solution for applications demanding a small footprint. Based on Tantalum Nitride Technology, this Ultra Low Profile wire bondable chip utilizes the smallest possible area for single resistor, multiple resistor array and resistor network configurations. The design can be customized as per customer specification with a profile as low as 100 microns and a wire bondable material of either gold or aluminum.